With a launch expected in just over two months’ time, a major new Galaxy S24 Ultra leak has revealed a breakthrough technique Samsung will be using to increase the performance and efficiency of the flagship smartphone.
Korea Daily has details on Samsung’s use of the Fan-Out Wafer Level Packaging technology that will be used in the company’s next-generation silicon and that the mass production of FOWLP chips is reportedly under way. The new technology is expected to be used in the recently announced Exynos 2400 chipset—which will be used in many of the upcoming Galaxy S24 and Galaxy S24+ handsets.
FOWLP offers several advantages in construction, allowing chips to be directly attached to the silicon wafer. The resulting chips are smaller, thinner, and provide more performance.
These are essential areas for Samsung to focus on. Its Exynos chipsets have been seen as not matching the performance or efficiency of the equivalent chipsets from Qualcomm. 2024’s Galaxy S24 and Galaxy S24+ will be available with either Samsung’s own Exynos 2400 chipset or a specially commissioned Qualcomm Snapdragon 8 Gen 3 For Samsung chipset. The South Korean company will be doing everything it can to overcome the community’s disdain for the Exynos chip by offering similar levels of performance and efficiency no matter the chipset available in someone’s country.
While consumers looking to buy the Galaxy S24 Ultra can rest easy knowing that the Ultra is only available with a Snapdragon 8 Gen 3, those looking to buy the low- and mid-tier handsets in Exynos regions will be hoping Samsung can unlock the full potential of its homegrown silicon.
The Galaxy S24 family of handsets is expected to launch in early 2024, with some commentators looking towards a debt in late January.
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